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6H Semi-insulating SiC - Can't Offer Temporarily

Model NO.:intanetcms000044
6H Semi-insulating SiC - Can't Offer Temporarily
FEATURE

PAM-XIAMEN offers 6H Semi-insulating silicon carbide wafers. --Can't Offer Temporarily*

* Due to the rapid changes in the semiconductor wafer market and our production lines, our supply capacity will change with it, but the changes will not be shown on our website. So we reserve the right to explain all the information on our website.

SILICON CARBIDE MATERIAL PROPERTIES
 Polytype Single Crystal 4H Single Crystal 6H
Lattice Parameters  a=3.076 Å  a=3.073 Å 
c=10.053 Å  c=15.117 Å 
Stacking Sequence  ABCB  ABCACB 
Band-gap  3.26 eV  3.03 eV 
Density  3.21 · 103 kg/m3  3.21 · 103 kg/m3 
Therm. Expansion Coefficient  4-5×10-6/K  4-5×10-6/K 
Refraction Index  no = 2.719  no = 2.707 
ne = 2.777  ne = 2.755 
Dielectric Constant  9.6 9.66
Thermal Conductivity  490 W/mK 490 W/mK
Break-Down Electrical Field  2-4 · 108 V/m 2-4 · 108 V/m
Saturation Drift Velocity  2.0 · 105 m/s 2.0 · 105 m/s
Electron Mobility  800 cm2/V·S  400 cm2/V·S 
hole Mobility  115 cm2/V·S  90 cm2/V·S 
Mohs Hardness  ~9 ~9 
6H SIC,SEMI-INSULATING , 2″WAFER SPECIFICATION
SUBSTRATE PROPERTY S6H-51-SI-PWAM-250 S6H-51-SI-PWAM-330 S6H-51-SI-PWAM-430
Description A/B Production Grade C/D Research Grade D Dummy Grade 6H SEMI Substrate
Polytype  6H 
Diameter  (50.8 ± 0.38) mm 
Thickness  (250 ± 25) μm                     (330 ± 25) μm                (430 ± 25) μm
Resistivity (RT)  >1E5 Ω·cm 
Surface Roughness  < 0.5 nm (Si-face CMP Epi-ready); <1 nm (C- face Optical polish) 
FWHM  A<30 arcsec                   B/C/D <50 arcsec  
Micropipe Density  A+≤1cm-2 A≤10cm-2   B≤30cm-2 C≤50cm-2 D≤100cm-2
Surface Orientation 
On axis  <0001>± 0.5° 
Off axis  3.5° toward <11-20>± 0.5° 
Primary flat orientation  Parallel {1-100} ± 5° 
Primary flat length  16.00 ± 1.70 mm 
Secondary flat orientation  Si-face:90° cw. from orientation flat ± 5° 
  C-face:90° ccw. from orientation flat ± 5° 
Secondary flat length  8.00 ± 1.70 mm 
Surface Finish  Single or double face polished
Packaging  Single wafer box or multi wafer box
Usable area  ≥ 90 % 
Edge exclusion  1 mm 
6H Semi-insulating SIC,5mm*5mm, 10mm*10mm WAFER SPECIFICATION : Thickness:330μm/430μm
6H Semi-insulating SIC,15mm*15mm, 20mm*20mm WAFER SPECIFICATION: Thickness:330μm/430μm
a-plane SiC Wafer, size: 40mm*10mm,30mm*10mm,20mm*10mm,10mm*10mm,specs below: 
6H Semi-insulating Thickness:330μm/430μm or custom


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