Lapping Wafer

Model NO.:intanetcms000048
Lapping Wafer
FEATURE

PAM-XIAMEN offers lapped silicon carbide wafers, As-cut wafers are lapped and cleaned to be qualified as lapped wafers.

Lapping process can reduce surface roughness and mechanical defects from as-cut wafers and can further improve geometrical performance

 4" 4H Silicon Carbide
Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area
　           N-Type 
S4H-100-N-SIC-370-L 4" 4H-N 0°/4°±0.5° 370±25um D * L/L >75%
3" 4H Silicon Carbide
Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area
　          N-Type 
S4H-76-N-SIC-370-L 3" 4H-N 0°/4°±0.5° 370±25um D * L/L >75%
2" 4H Silicon Carbide
Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area
　 N-Type 
S4H-51-N-SIC-370-L 2" 4H-N 0°/4°±0.5° 370±25um D * L/L >75%
2" 6H Silicon Carbide
Item No. Type Orientation Thickness   Grade Micropipe Density Surface Usable area
　 N-Type 
S6H-51-N-SIC-370-L 2" 6H-N 0°/4°±0.5° 370±25um D * L/L >75%
　 SEMI-INSULATING 
S6H-51-SI-SIC-370-L 2" 6H-SI 0°/4°±0.5° 370±25um D * L/L >75%


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